708 CEGA/HCPA9A

Hybrid Ceramic Super Precision Bearings

708 CEGA/HCPA9A Hybrid Ceramic Super Precision Bearings
708 CEGA/HCPA9A Hybrid Ceramic Super Precision Bearings

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Part No.
Part No. 708 CEGA/HCPA9A

Basic Information

System of measurement Metric
Weight 0.011 kg
Tolerance class PA9A
Seal type Open
For load direction Angular Contact

Main Dimensions

Bore diameter 8 mm
Bore diameter tolerance -0.004mm to 0
Outside diameter 22 mm
Outside diameter tolerance -0.004mm to 0
Width 7 mm
Width tolerance -0.2mm to 0
Contact angle 15 °

Ball & Washer Dimensions

Ball diameter 3.969 mm
Ball quantity 8

Performance

Temperature range - 30°C to 110 °C
Radial dynamic load rating 526 lbf
Radial static load rating 180 lbf
Limiting speed 100 X 1000 rpm
Lubrication Lubricated
Matched arrangement Single
Number of bearings in matched set 2
Universal matching bearing Universal Matchable (SU)
Preload Extra light / Class A

Materials

Ring material Chrome Steel
Ball material Ceramic
Cage material Phenolic
Technical Drawings No drawings available at the moment, will be launched soon
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708 CEGA/HCPA9A Bearing Product Overview & Core Advantages

The 708 CEGA/HCPA9A is a single row angular contact ball bearing engineered for high-precision applications demanding exceptional rotational accuracy and speed. This metric bearing features a 15° contact angle and an Extra Light (Class A) preload, making it ideally suited for spindle arrangements where minimal deflection and high rigidity are critical. Its universal matchable (SU) design allows for flexible mounting in duplex pairs (back-to-back or face-to-face) to support combined radial and axial loads. The use of a phenolic cage and ceramic balls contributes to its outstanding high-speed performance and reduced rotating mass.

708 CEGA/HCPA9A Bearing Model Code Explained, Specifications & Naming Convention

Code Segment Technical Meaning Significance
708 Basic Bearing Series/Size Defines the core dimensions: 8mm bore, 22mm OD, 7mm width.
CE 15° Contact Angle Optimized for handling axial loads in one direction.
GA Extra Light Preload (Class A) Provides minimal starting torque and high running accuracy, ideal for ultra-high-speed operation.
HC Hybrid Ceramic Indicates the use of ceramic balls, offering reduced weight, lower friction, and increased durability.
PA9A High-Precision Tolerance Class Denotes extremely tight dimensional and running accuracy tolerances for superior performance.

708 CEGA/HCPA9A Bearing Structural Features & Performance Benefits

  • Hybrid Ceramic Construction: The combination of chrome steel rings and silicon nitride (Si3N4) ceramic balls significantly reduces centrifugal forces, allowing for a higher limiting speed of 100,000 rpm. This also results in lower operating temperatures, extended service life, and improved resistance to electrical arcing.
  • Phenolic Resin Cage: The lightweight and robust phenolic cage ensures excellent dimensional stability at high speeds and provides superior guidance for the ceramic balls, contributing to smooth and quiet operation.
  • Precision Ground Raceways: Manufactured to PA9A tolerance class with a precise 15° contact angle, this bearing delivers exceptional running accuracy and rotational stability, which is crucial for applications requiring high positional repeatability.
  • Universal Matching (SU): This bearing is supplied as a universal matchable single bearing. Two bearings can be universally paired in any combination (DB, DF, DT) to create a pre-loaded set capable of supporting combined loads and moment loads, offering design flexibility and high rigidity.

708 CEGA/HCPA9A Bearing Typical Application Areas

The 708 CEGA/HCPA9A is specifically designed for high-performance machinery where speed, precision, and reliability are paramount. Key industries and equipment include:

  • High-Frequency Spindles: CNC machining centers, PCB drilling machines, and precision grinders.
  • Medical and Dental Equipment: High-speed handpieces, centrifuges, and scanner motors.
  • Aerospace and Defense: Gyroscopes, navigation systems, and auxiliary power units (APUs).
  • Semiconductor Manufacturing: Robotic wafer handlers and precision stages.
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